Materion Balzers Optics
  1. Home
  2. DatasheetsNew
  3. OBA
  4. MBO 042 PE

Wafer Level Packaging

Coated Glass Wafer for Advanced Optical Packaging

Wafer Level Packaging is the cutting edge technology for high volume optical packaging. The glass wafer is merged with the silicon wafer before dicing. Some of the applications require a spacer between the two wafers. Materion Balzers Optics provides glass wafers with low defect optical coatings – if required with Chrome apertures for light beam shaping.

Coated Glass Wafer for Advanced Optical Packaging

Benefits

  • High cleanliness at assembly step
  • High yields due to clean work pieces
  • Reduced handling efforts
  • Lowers cost due to parallel assembly step on devices
  • Enables further miniaturization


Applications/Technical Data

IR Cut Filters on WLP




Application CMOS Packaging

Size of wafer 200 mm round, 0.3/0.4 mm thick

Typical glass type SCHOTT D263® T eco

Defect Level No defects > 50 µm

Anti Reflex Coatings on WLP




Applications MEMS/CMOS Packaging

Size of wafer 200 mm round, 1.1 mm thick

Typical glass type BOROFLOAT®

Defect Level No defects > 20 µm

Index Matched ITO on WLP




Applications LCOS Microdisplays Packaging

Size of wafer 200 mm round, 0.7/1.1 mm thick

Typical glass type Corning 1737, Eagle XG

Defect Level No defects > 10 µm on ITO side

semiconductor wafer (SW) & glass wafer (GW)




Schematic Wafer Level Packaging: Entire semiconductor wafer (SW) with array of sensors is covered by a cover glass wafer (GW) – see left side. Combined wafers are cut into pieces (right side).

> PDF Download