Search

Patterned Gelot™ for Advanced Optical Packaging

Solderable Glass Lids

Light sensitive semiconductor devices require a packaging including a transparent glass lid. Soldering is the assembly technology which provides best hermeticity values of such packagings. Gelot™ solderable coating gives the glass a surface which is well adhesive to solder such as Gold or Palladium. Gelot™ is applied to the lid in form of a frame with a clear aperture.

Solderable Glass Lids

Benefits

Soldering of glass to metals and ceramics
Excellent hermeticity values in assemblies with glass lids
Suitable for high temperature applications
Excellent shelf life values due to non-corrosive surface
Frames may be used as apertures
Allows clean assembly process
Wafer Level Packaging (WLP) can be supported

Applications

Packaging of semiconductor devices such as CCD/CMOS sensors, MEMS.

Technical Data

Outer surface of coating Gold

Thickness of coating 300 nm

Minimum feature size of coating 20 µm

Size of Lids up to 120 mm sq.

Adhesion > 10 N/mm²

Shear strength > 4 N/mm²

Recommendations

Solder preform: Au, Pd (Al, Zn or Cd to be avoided)

Stencilled AR on clear aperture

Scetch of soldered assembly
The Gelot™ coating provides the glass a solderable surface.
The solder itself must be applied in form of a preform.

Scetch of soldered assembly

> PDF Download